Led lamp with an inner channel and an outer channel for heat dissipating of power source

ABSTRACT

An LED lamp includes: a lamp head; a passive heat dissipating element having a heat sink; a power source; a light emitting surface comprising LED chips electrically connected to the power source; a first heat dissipating channel; a second heat dissipating channel; and a lamp cover; wherein the first heat dissipating channel comprises a first end and a second end; wherein the second heat dissipating channel comprises a third end on the light emitting surface; wherein the power source includes a power board and a plurality of electronic components mounted thereon; wherein the first heat dissipating channel includes an inner channel and an outer channel, a transformer of the electronic components includes a core and coils, the core has a second chamber in which the coils are disposed, an opening is formed at a side of the second chamber in a radial direction to expose the coils, the opening corresponds to the inner channel or the outer channel.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 16/267,747 filed on 2019 Feb. 5, which claims priority to thefollowing Chinese Patent Applications No. CN 201810130085.3 filed on2018 Feb. 8, CN 201810479044.5 filed on 2018 May 18, CN 201810523952.Xfiled on 2018 May 28, CN 201810573322.3 filed on 2018 Jun. 6 , CN201810634571.9 filed on 2018 Jun. 20, CN 201810763800.7 field on 2018Jul. 12 , CN 201810763089.5 filed on 2018 Jul. 12, CN 201810972904.9filed on 2018 Aug. 24, CN 201811172470.0 filed on 2018 Oct. 9, CN201811295618.X filed on 2018 Nov. 1, CN 201811299410.5 filed on 2018Nov. 2, CN 201811347198.5 filed on 2018 Nov. 13, CN 201811378174.6 filedon 2018 Nov. 19, and CN 201811466198.7 filed on 2018 Dec. 3, thedisclosures of which are incorporated herein in their entirety byreference.

FIELD OF THE INVENTION

The invention relates to lighting, particularly to LED lamps with aninner channel and an outer channel for heat dissipating of power source.

BACKGROUND OF THE INVENTION

Because LED lamps possess advantages of energy saving, high efficiency,environmental protection and long life, they have been widely adopted inthe lighting field. For LED lamps used as an energy-saving green lightsource, a problem of heat dissipation of high-power LED lamps becomesmore and more important. Overheating will result in attenuation oflighting efficiency. If waste heat from working high-power LED lampscannot be effectively dissipated, then the life of LED lamps will bedirectly negatively affected. As a result, in recent years, solution ofthe problem of heat dissipation of high-power LED lamps is an importantissue for the industry.

OBJECT AND SUMMARY OF THE INVENTION

The LED lamp described in the present disclosure includes an LED (lightemitting diode) lamp including a lamp shell including a lamp head, alamp neck and a sleeve, the lamp head connects to the lamp neck whichconnects to the sleeve; a passive heat dissipating element having a heatsink connected to the lamp shell, wherein the heat sink comprises finsand a base, the sleeve of the lamp shell is located in the heat sink,the lamp neck projects from the heat sink, height of the lamp neck is atleast 80% of height of the heat sink; a power source having a firstportion and a second portion, wherein the first portion of the powersource is disposed in both the lamp neck and the lamp head of the lampshell, and the second portion of the power source is disposed in theheat sink of the passive heat dissipating element; a light emittingsurface connected to the heat sink of the passive heat dissipatingelement and comprising LED chips electrically connected to the powersource, wherein the light emitting surface and the heat sink areconnected to form a heat transferring path from the LED chips to thepassive heat dissipating element; a first heat dissipating channelformed in a first chamber of the lamp shell for dissipating heatgenerated from the power source while the LED lamp is working, and thefirst chamber is located between the bottom of the LED lamp and theupper portion of the lamp neck; a second heat dissipating channel formedin the heat sink and between the fins and the base for dissipating theheat generated from the LED chips and transferred to the heat sink; anda lamp cover connected with the heat sink and having a light outputsurface and an end surface, wherein the end surface is formed with avent to allow air flowing from outside of the LED lamp into both thefirst heat dissipating channel and the second heat dissipating channelthrough the vent; wherein the first heat dissipating channel comprises afirst end on the light emitting surface to allow air flowing fromoutside of the LED lamp into the first chamber, and a second end on theupper portion of the lamp neck of the lamp shell to allow air flowingfrom inside of the first chamber out to the LED lamp; wherein the secondheat dissipating channel comprises a third end on the light emittingsurface to allow air flowing from outside of the LED lamp into thesecond heat dissipating channel, and flowing out from spaces betweenevery adjacent two of the fins; wherein the power source includes apower board and a plurality of electronic components mounted thereon;wherein the first heat dissipating channel includes an inner channel andan outer channel, the outer channel is formed between the electroniccomponents on an edge of the power board and an inner wall of the firstchamber of the lamp shell, the inner channel is formed in gaps betweenthe electronic components, a transformer of the electronic componentsincludes a core and coils, the core has a second chamber in which thecoils are disposed, an opening is formed at a side of the second chamberin a radial direction to expose the coils, and the opening correspondsto the inner channel or the outer channel.

Preferably, two openings are separately formed at two sides of thesecond chamber in a radial direction, one of the two openingscorresponds to the inner channel and the other one thereof correspondsto the outer channel.

Preferably, the electronic components include heat-generating elements,at least one of the heat-generating element is in thermal contact withthe lamp head through a thermal conductor, the at least one of theheat-generating element is disposed in the lamp head.

Preferably, the thermal conductor is disposed in the lamp head throughfilling to implement connection between the lamp head and theheat-generating element, the thermal conductor only cloaks an endportion of the power source and is higher than the second end on theupper portion of the lamp neck of the lamp shell in position.

Preferably, the lamp head includes a metal portion, at least part of aninner side of the metal portion constitutes a wall of the inner chamberof the lamp shell to make the thermal conductor directly connect withthe metal portion.

Preferably, at least one of the electronic components of the powersource, which is most adjacent to the first end of the first heatdissipating channel is an electrolytic capacitor.

Preferably, part of the electrolytic capacitor exceeds the power boardin the axial direction of the LED lamp.

Preferably, the power board is divided into a first mounting zone and asecond mounting zone, total weight of the electronic components on thesecond mounting zone is greater than total weight of the electroniccomponents on the first mounting zone, and a counterweight is providedon the first mounting zone to balance the two zones of the power boardin weight.

Preferably, the counterweight is a heat dissipating element with heatdissipating function and is disposed on the power board.

Preferably, the heat dissipating assembly has fins for increasing heatdissipating area, the fins are extendedly arranged along the axialdirection of the LED lamp, a channel is formed between two adjacent finsas an air passage.

Preferably, an aperture is located in a central region of the lightboard, and the aperture forms an air intake of both the first heatdissipating channel and the second heat dissipating channel.

Preferably, the sleeve corresponds to the aperture.

Preferably, the heat sink comprises first fins and second fins, bottomsof both the first fins and the second fins in an axis of the LED lampconnect to the base, the first fins interlace with the second fins atregular intervals, and one of the second fins includes a third portionand two fourth portions, the two fourth portions are symmetrical aboutthe third portion.

Preferably, each of the first fins is divided into two portions in aradial direction of the LED lamp, the two portions are divided with agap portion, the third portion is connected to the fourth portionthrough a transition portion, the transition portion has a buffersection and a guide section, a direction of any tangent of the guidesection is separate from the gap portion.

Preferably, the power board has a first portion in the lamp neck and asecond portion in the sleeve, the second portion more adjacent to thefirst end of the first heat dissipating channel than the first portion.

Preferably, at least part of the electrolytic capacitors are disposed inthe second portion.

Preferably, all of the electrolytic capacitors are disposed in thesecond portion.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed descriptions, given by way of example, and notintended to limit the present invention solely thereto, will be best beunderstood in conjunction with the accompanying figures:

FIG. 1 is a structural schematic view of one embodiment of an LED lampaccording to aspects of the invention;

FIG. 2 is a schematic cross-sectional view of the LED lamp of FIG. 1;

FIG. 3 is an exploded view of the LED lamp of FIG. 1;

FIG. 4 is a schematic cross-sectional view of the LED lamp of FIG. 1,which shows the first heat dissipating channel and the second heatdissipating channel;

FIG. 5 is a perspective view of the LED lamp of FIG. 1;

FIG. 6 is a structural schematic view of FIG. 5 without the light outputsurface;

FIG. 7 is a perspective view of an LED lamp, according to anotherembodiment of the present invention;

FIG. 8 is a cross-sectional view of the LED lamp of FIG. 7;

FIG. 9 is a top view of the heat sink of the LED lamp of FIG. 7;

FIG. 10 is an enlarged view of portion E in FIG. 9;

FIG. 11 is a schematic view showing a vortex formed by air near thesecond fins according to another embodiment of the present invention;

FIG. 12 is a bottom view of the LED lamp of FIG. 1 without the lampcover;

FIG. 13 is an enlarged view of portion A in FIG. 12;

FIGS. 14A˜14C are perspective views of the power source, according tosome embodiments of the present invention;

FIG. 14D is a main view of the power source of the embodiment of FIGS.14A˜14C;

FIG. 15 is a schematic view of the power source, according to oneembodiment of the present invention;

FIG. 16 is a main view of the counterweight of FIG. 15;

FIG. 17 is a side view of the counterweight of FIG. 16;

FIG. 18 is a schematic view of a transformer, according to oneembodiment of the present invention;

FIG. 19 is an enlarged view of portion B in FIG. 2;

FIG. 20 is a partially schematic view of an LED lamp;

FIG. 21 is a block diagram of the power module of an embodiment of theinvention;

FIG. 22 is a circuit diagram of an EMI reduction circuit of anembodiment of the invention;

FIG. 23 is a circuit diagram of a rectifier and a filter of anembodiment of the invention;

FIG. 24 is a circuit diagram of a PFC of an embodiment of the invention;

FIG. 25 is a circuit diagram of a power converter of an embodiment ofthe invention;

FIG. 26 is a circuit diagram of a bias generator of an embodiment of theinvention;

FIG. 27 is a circuit diagram of a bias generator of another embodimentof the invention;

FIG. 28 is a circuit diagram of a temperature detector of an embodimentof the invention; and

FIG. 29 is a circuit diagram of a temperature compensator of anembodiment of the invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

To make the present invention understandable and readable, the followingdisclosure will now be described in the following embodiments withreference to the drawings. The following descriptions of variousembodiments of this invention are presented herein for purpose ofillustration and giving examples only.

FIG. 1 is a structural schematic view of an embodiment of an LED lampaccording to certain aspects of the invention. FIG. 2 is a schematiccross-sectional view of the LED lamp of FIG. 1. FIG. 3 is an explodedview of the LED lamp of FIG. 1. As shown in the figures, the LED lampincludes a heat sink 1, a lamp shell 2, a light board 3, a lamp cover 4and a power source 5. In this embodiment, the light board 3 is connectedto the heat sink 1 by attachment for rapidly transferring heat from thelight board 3 to the heat sink 1 when the LED lamp is working. In someembodiments, the light board 3 is riveted to the heat sink 1. In someembodiments, the light board 3 is screwed to the heat sink 1. In someembodiments, the light board 3 is welded to the heat sink 1. In someembodiments, the light board 3 is adhered to the heat sink 1. In thisembodiment, the lamp shell 2 is connected to the heat sink 1, the lampcover 4 covers the light board 3 to make light emitted from the lightboard 3 pass through the lamp cover to project out. The power source 5is located in a chamber of the lamp shell 2 and the power source 5 is ECto the LED chips 311 for providing electricity.

FIG. 4 is a schematic cross-sectional view of the LED lamp. As shown inFIGS. 2 and 4, the chamber of the lamp shell 2 of this embodiment isformed with a first heat dissipating channel 7 a. An end of the firstheat dissipating channel is formed with a first air inlet 2201. Anopposite end of the lamp shell 2 is formed with a venting hole 222 (atan upper portion of the lamp neck 22). Air flows into the first heatdissipating channel 2201 and flows out from the venting hole 222 forbringing out heat in the first heat dissipating channel 7 a (primarily,heat of the working power source 5). As for the path of heatdissipation, heat generated from the heat-generating components of theworking power source 5 is transferred to air (around the heat-generatingcomponents) in the first heat dissipating channel 7 a by thermalradiation first, and then external air enters the first heat dissipatingchannel 7 a by convection to bring out internal air to make heatdissipation. In this embodiment, the venting hole 222 at the lamp neck22 can also make direct heat dissipation.

As shown in FIGS. 1, 2 and 4, a second heat dissipating channel 7 b isformed in the fins and the base 13 of the heat sink 1. The second heatdissipating channel 7 b has a second air inlet 1301. In this embodiment,the first air inlet 2201 and the second air inlet 1301 share the sameopening formed on the light board 3. This will be described in moredetail later. Air flows from outside of the LED lamp into the second airinlet 1301, passes through the second heat dissipating channel 7 b andfinally flows out from spaces between the fins 11 so as to bring outheat of the fins 11 to enhance heat dissipation of the fins 11. As forthe path of heat dissipation, heat generated from the LED chips isconducted to the heat sink 1, the fins 11 of the heat sink 1 radiate theheat to surrounding air, and convection is performed in the second heatdissipating channel 7 b to bring out heated air in the heat sink 1 tomake heat dissipation.

FIG. 5 is a perspective view of the LED lamp of an embodiment, whichshows assembling of the heat sink 1 and the lamp cover 4. FIG. 6 is astructural schematic view of FIG. 5 without the light output surface 43.As shown in FIGS. 5 and 6, in this embodiment, the lamp cover 4 includesa light output surface 43 and an end surface 44 with a vent 41. Airflows into both the first heat dissipating channel 7 a and the secondheat dissipating channel 7 b through the vent 41. When the LED chips 311(shown in FIG. 6) are illuminated, the light passes through the lightoutput surface 43 to be projected from the lamp cover 4. The term “LEDchip” mentioned in all embodiments of the invention means all lightsources with one or more LEDs (light emitting diodes) as a main part,and includes but is not limited to an LED bead, an LED strip or an LEDfilament. Thus, the LED chip mentioned herein may be equivalent to anLED bead, an LED strip or an LED filament.

As shown in FIGS. 1 and 2, in this embodiment, the LED lamp includespassive heat dissipating elements which adopt natural convection andradiation as a heat dissipating manner without any active heatdissipating elements such as a fan. The passive heat dissipating elementin this embodiment includes a heat sink 1 composed of fins 11 and a base13. The fins 11 radially extend from and connect to the base 13. Whenusing the LED lamp, at least part of heat from the LED chips 311 isconducted to the heat sink 1 by thermal conduction. At least part ofheat occurring from the heat sink 1 is transferred to external air bythermal convection and radiation. A diameter of a radial outline of theheat sink 1, in a hanging status as shown in the figures, tapers offupward or is substantially in a taper shape for a better match with alampshade.

FIG. 9 is top view of the heat sink 1 of the LED lamp of an embodiment.As shown, the heat sink 1 suffers the above volume limit, so at leastpart of the fins 11 are extended outward in a radial direction of theLED lamp with at least two sheets at an interval. By such anarrangement, the fins 11 in a fixed space can have larger area of heatdissipation. In addition, the extended sheets form support to the fins11 to make the fins firmly supported on the base 13 to prevent the fins11 from deflecting.

In detail, as shown in FIG. 9, the fins include first fins 111 andsecond fins 112. The bottoms of both the first fins 111 and the secondfins 112 in an axis of the LED lamp connect to the base 13. The firstfins 111 interlace with the second fins 112 at regular intervals. Beingprojected from the axial direction of the LED lamp, each of the secondfins 112 is to be seen as a Y-shape. Such Y-shaped second fins 112 canhave more heat dissipating area under a condition of the heat sink 1occupying the same volume. In this embodiment, both the first fins 111and the second fins are evenly distributed on a circumference,respectively. Every adjacent two of the second fins 112 are symmetricalabout one of the first fins 111.

As shown in FIG. 9, at least one of the fins 11 is divided into twoportions in a radial direction of the LED lamp. Thus, a gap between thetwo portions forms a passage to allow air to pass. In addition, theprojecting area of the gap directly exactly corresponds to an area thatthe LED chips 311 are positioned on the LED board 3 to enhanceconvection and improve an effect of heat dissipation to the LED chips311. In an aspect of limited overall weight of the LED lamp, part of thefins 11 divided with a gap reduces the amount of the fins 11, decreasesoverall weight of the heat sink 1, and provides a surplus space toaccommodate other elements.

FIG. 10 is an enlarged view of portion E in FIG. 9. As shown in FIGS. 9and 10, the fins 11 include first fins 111 and second fins 112. Each ofthe first fins 11 is divided into two portions in a radial direction ofthe LED lamp, i.e. a first portion 111 a and a second portion 111 b. Thetwo portions are divided with a gap portion 111 c. The first portion 111a is located inside the second portion 111 b in a radial direction. Eachof the second fins 112 has a third portion 112 a and a fourth portion112 b extending therefrom. The fourth portions 112 b are locatedradially outside the third portions 112 a to increase space utilizationand make the fins have more heat dissipating are for heat dissipation.As shown in FIG. 10, the third portion 112 a is connected to the fourthportion 112 b through a transition portion 113. The transition portion113 has a buffer section 113 a and a guide section 113 b. At least oneor both of the buffer section 113 a and the guide section 113 b arearced in shape. In other embodiment, both the buffer section 113 a andthe guide section 113 b are formed into an S-shape or an invertedS-shape. The buffer section 113 a is configured to prevent air radiallyoutward flowing along the second fins 112 from being obstructed to causevortexes. Instead, the guide section 113 b is configured to be able toguide convection air to radially outward flow along the second fins 112without interference (as shown in FIG. 11).

As shown in FIG. 10, one of the second fins 112 includes a third portion112 a and two fourth portions 112 b. The two fourth portions 112 b aresymmetrical about the third portion 112 a.

As shown in FIG. 10, a direction of any tangent of the guide section 113b is separate from the gap portion 111 c to prevent convection air fromflowing into the gap portion 111 c through the guide portion 113 b, suchthat the poor efficiency of heat dissipation caused by longer convectionpaths is able to be avoid as well. Preferably, a direction of anytangent of the guide section 113 b is located radially outside the gapportion 111 c. In other embodiments, a direction of any tangent of theguide section 113 b is located radially inside the gap portion 111 c.

FIG. 12 is a bottom view of the LED lamp of FIG. 1 without the lampcover 4. FIG. 13 is an enlarged view of portion A in FIG. 12. As shownin FIGS. 12 and 13, the heat sink 1 is disposed outwardly of the sleeve21, and the power source 5 is disposed in the inner space of the sleeve21. A distance is kept between distal ends of the fins 11 and the sleeve21. Accordingly, the sleeve 21 which has been heated to be thermallyexpanded will not be pressed by the fins 11 to be damaged. Also, heatfrom the fins 11 will not be directly conducted to the sleeve 21 toadversely affect electronic components of the power source 5 in thesleeve 21. Finally, air existing in the distance between the fins 11 andthe sleeve 21 of the lamp shell 2 (as shown in FIG. 3) possesses aneffect of thermal isolation so as to further prevent heat of the heatsink 1 from affecting the power source 5 in the sleeve 21. In otherembodiments, to make the fins 11 have radial support to the sleeve 21,distal ends of the fins 11 may be in contact with an outer surface ofthe sleeve 21 and another part of the fins 11 are not in contact withthe sleeve 21. Such a design may be applied in the LED lamp shown inFIG. 12. As shown in FIG. 12, the light board 3 includes a thirdaperture 32 for exposing both the first air inlet 2201 of the first heatdissipating channel 7 a and the second air inlet 1301 of the second heatdissipating channel 7 b. In some embodiments, to rapidly dissipate heatfrom the power source 5, the ratio of cross-sectional area of the firstair inlet 2201 to cross-sectional area of the second air inlet 1301 isgreater than 1 but less than or equal to 2. In some embodiments, torapidly dissipate heat from the power source 5, the ratio ofcross-sectional area of the second air inlet 1301 to cross-sectionalarea of the first air inlet 2201 is greater than 1 but less than orequal to 1.5.

As shown in FIG. 12, in this embodiment, the light board 3 includes atleast one LED chip set 31 having LED chips 311.

As shown in FIGS. 4 and 12, the light board 3 is formed with a thirdaperture 32 separately communicating with the first heat dissipatingchannel 7 a and the second heat dissipating channel 7 b. For example,the third aperture 32 communicates with spaces between the fins 11 andthe chamber of the lamp shell 2 to form air convection paths between thespaces between the fins 11 and between the chamber of the lamp shell 2and the outside of the Led lamp. The third aperture 32 is located insidethe inner ring of the LED lamp. Thus, it would not occupy the space ofthe reflecting region 3001 to affect reflective efficiency. In detail,the third aperture 32 is located at a central region of the light board3 and both the first air inlet 2201 and the second air inlet 1301 makeair intake through the same aperture (the third aperture 32). In oneexample, after convection air passes through the third aperture 32, andthen enters the first air inlet 2201 and the second air inlet 1301. Thethird aperture 32 is located at a central region of the light board 3,so both the first air inlet 2201 and the second air inlet 1301 cancommonly use the same air intake. Thus, this can prevent occupying anexcessive region of the light board 3 and prevent the usable regionalarea of the light board 3 for disposing the LED chips 311 fromdecreasing due to multiple air intakes. On the other hand, the sleeve 21corresponds to the third aperture 32, so convection air may have aneffect of thermal isolation to prevent temperatures inside and outsidethe sleeve 21 from mutually affecting each other when air enters. Inother embodiments, if both the first air inlet 2201 and the second airinlet 1301 are located at different positions, then the third aperture32 may be multiple in number to correspond to both the first air inlet2201 and the second air inlet 1301.

FIGS. 14A˜14C are perspective views of the power source 5 of oneembodiment at different viewpoints. FIG. 14D is a main view of the powersource 5 of one embodiment. The power source 5 is electrically connectedto the LED chips 311 to power the LED chips 311. As shown in FIGS.14A˜14C, the power source 5 includes a power board 51 and a plurality ofelectronic components mounted thereon.

As shown in FIG. 14C, a transformer 54 in the electronic componentsincludes a core 541 and coils 542. The core 541 has a room in which thecoil 542 is received. The room has an opening in the axial direction ofthe LED lamp so as to make heat generated from the coils 542 and thecore 541 move upward. Also, the heat dissipating direction of thetransformer 54 is consistent with the convection path of the first heatdissipating channel 7 a (as mentioned in the description of FIG. 4) forbeing advantageous to heat dissipation.

As shown in FIGS. 14B and 14C, the room is provided with two openings attwo ends in the axial direction of the LED lamp to increase heatdissipating effect to the coils 542. In addition, after the coils 542are installed in the room of the core 541, a gap is kept between thecoils 542 and the room to allow air to flow. This can further increaseheat dissipating effect to the coils 542.

As shown in FIG. 14B, the transformer 54 has a first side 5401 and asecond side 5402, both of which are perpendicular to the power board.The first side 5401 is perpendicular to the axial direction of the lamp.The first side 5401 is less than the second side 5402 in area. Thus,such an arrangement of the small side can reduce resistance toconvection of the first heat dissipating channel 7 a.

As shown in FIG. 14C, the electronic components include at least oneinductor 55 including an annular core 551. A coil is wound around theannular core 551 (not shown). An axis of the annular core 551 isparallel to the axis of the LED lamp to make the coil have larger areato be in contact with convection air. This can further increase heatdissipating effect to the inductor 55. In addition, a shape of theannular core 551 corresponds to the convection path of the first heatdissipating channel 7 a. Thus, convection air can pass through theinside of the annular core 551 to further increase heat dissipatingeffect to the inductor 55.

As shown in FIGS. 14A and 14B, heat-generating elements in theelectronic components include integrated circuits (ICs) 56, diodes,transistors, the transformer 54, the inductor 55 and resistors. Theseheat-generating elements are separately mounted on the power board 51 todistribute heat-generating sources and prevent local high temperature.In addition, the heat-generating elements may be mounted on differentsurfaces of the power board 51 to perform heat dissipation. At thistime, the heat-generating elements are in contact with correspondingheat dissipating elements.

As shown in FIGS. 14A and 14B, at least one IC 56 is arranged to bemounted on different surface as other heat-generating elements arearranged of the power board 51. As a result, the heat-generating sourcescan be separated to avoid local high temperature and influence to the IC56 from the other heat-generating elements.

As shown in FIGS. 14A and 14B, in a direction perpendicular to the powerboard 51 (i.e. projection relationship in a direction perpendicular tothe power board 51), the IC 56 does not overlap any heat-generatingelements to avoid heat accumulation.

As shown in FIG. 8, the power board 51 is parallel to the axis of theLED lamp. Thus, in the axial direction of the LED lamp, the power board51 is divided into an upper portion and a lower portion. Arrangingspaces of both the upper portion and the lower portion are identical orapproximately identical to form better layout of the electroniccomponents. Besides, if the power board 51 inclines toward the axis ofthe LED lamp, then air flow may be obstructed and it is disadvantageousto heat dissipation of the power source 5.

As shown in FIGS. 1 and 8, the power board 51 divides the lamp shell 2into a first portion 201 and a second portion 202. Area of the ventinghole 222 corresponding to the first portion 201 is greater than area ofthe venting hole 222 corresponding to the second portion 202. Thus, whenimplementing layout of electronic components, most or all of electroniccomponents or some thereof which generate a large amount of heat such asinductors, resistors, transformers, rectifiers or transistors may bedisposed in the first portion 201.

As shown in FIG. 8, the power board 51 divides an inner chamber of thelamp shell 2 into a first portion 201 and a second portion 202. Thefirst portion 201 is greater than the second portion 202 in volume. Whenimplementing layout of electronic components, most or all of electroniccomponents or some thereof which generate a large amount of heat such asinductors, resistors, transformers, rectifiers or transistors may bedisposed in the first portion 201.

Please simultaneously refer to FIGS. 8 and 12, area of first air inlet2201 corresponding to the first portion 201 is greater than area of thesecond air inlet 2202 corresponding to the second portion 202. Thus,more air can flow into the first portion 201 to perform heat dissipationto the electronic components. Here, the specific description of the airinlet is that the first air inlet 2201 is divided into two portions bythe power board 51, one of the two portions corresponds to the firstportion 201 and the other one of the two portions corresponds to thesecond portion 202 so as to make more air flow into the first air inlet2201 and enter the first portion 201.

As shown in FIG. 8, the electronic components 501 includeheat-generating elements 501. At least one of the heat-generatingelements 501 is adjacent to the lamp head 23 through which heat isdissipated without occupying resource of heat dissipation of the firstheat dissipating channel 7 a. The at least one heat-generating element501 above-mentioned is an inductor, a resistor, a rectifier or a controlcircuit.

As shown in FIG. 8, heat of the at least one heat-generating element istransferred to the lamp head 23 through thermal conduction or radiationand dissipated to air through the lamp head 23.

As shown in FIG. 8, the at least one heat-generating element 501 is inthermal contact with the lamp head 23. In detail, the at least oneheat-generating element 501 is located in the lamp head 23. Theheat-generating element 501 is in contact with the lamp head 23 througha thermal conductor 53 and the heat-generating element 501 is fastenedto the lamp head 23 through the thermal conductor 53. Therefore, thethermal conductor not only performs an effect of heat transfer but alsofixes the heat-generating element 501 to avoid loosening of theheat-generating element 501. The phrase “the heat-generating element 501is located in the lamp head 23” means both the lamp head 23 and theheat-generating element 501 have an overlapping area in a projectionperpendicular to the axis of the LED lamp.

As shown in FIG. 8, the thermal conductor 53 is disposed in the lamphead 23 through filling to implement connection between the lamp head 23and the heat-generating element 501. The thermal conductor 53 onlycloaks an end portion of the power source 5 and is higher than theventing 222 in position to prevent overweight resulting from the thermalconductor 53. Additionally, the thermal conductor 53 adopts aninsulative material to guarantee safety and prevent the electroniccomponents and metal portion 231 of the lamp head 23 from being incontact. In other embodiments, the thermal conductor 53 may also be awire connecting the power source 5 to the lamp head 23 (not shown).

As shown in FIG. 8, the lamp head 23 includes the metal portion 231,which is in thermal contact with the thermal conductor 53. That is, atleast part of an inner side of the metal portion 231 constitutes a wallof the inner chamber of the lamp shell 2 to make the thermal conductordirectly connect with the metal portion 231 and perform heat dissipationby the metal portion 231. Part of the metal portion 231 would performheat dissipation through air, and another part of the metal portionwould perform heat dissipation through a lamp socket connecting to themetal portion 231.

As shown in FIGS. 2 and 14A, in this embodiment, at least one of theelectronic components of the power source 5, which is the most adjacentto the first air inlet 2201 of the first heat dissipating channel 7 a isa heat intolerance component, such as a capacitor, especially for anelectrolytic capacitor. This arrangement can avoid overheating of theheat intolerance component to affect its performance.

In addition, to reduce influence of an electrolytic capacitor 502suffering heat from the heat-generating elements, a surface of theelectrolytic capacitor can be provided with an anti-radiation layer or athermo-isolation layer (not shown). The thermos-isolation layer mayadopt existing plastic material, and the anti-radiation layer may adoptexisting paint, silver plate layer, aluminum foil or otheranti-radiation materials.

As shown in FIG. 14A, in this embodiment, at least part of at least oneof the electrolytic capacitors 502 is not located within the power board51, i.e. at least part of the electrolytic capacitor exceeds the powerboard 51 in the axial direction of the LED lamp. Under a condition ofthe same number of the electronic components, length and material costof the power board 51. In addition, this can make the electrolyticcapacitor further adjacent to the first air inlet 2201 to ensure theelectrolytic capacitor to be located in a relatively low temperaturearea.

As shown in FIG. 8, a position of at least one of the heat-generatingelements 501 in the axial direction of the LED lamp is higher than aposition of the venting hole 222. Most heat of the heat-generatingelement 501 higher than the venting hole 222 is dissipated through thelamp head 23 or other paths. Thus, most heat therefrom is not dissipatedthrough the venting hole 222, and convection speed of the first heatdissipating channel 7 a would not be affected. The heat-generatingelement is an IC, a transistor, a transformer, an inductor, a rectifieror a resistor.

As shown in FIG. 8, the power board 51 is divided into an upper part anda lower part in the axial direction of the LED lamp. Heat-generatingelements are arranged in both the upper part and the lower part. Atleast one of the heat-generating elements in the upper part is locatedabove the venting hole 222 to lower the temperature of the upper partnear the venting hole 222. This can increase an air temperaturedifference between two venting holes 222 in the upper part and the lowerpart to enhance convection.

As shown in FIGS. 2, 3 and 14A, when the power board 51 is assembled inthe lamp shell 2, it has a first portion in the lamp neck 22 and asecond portion in the sleeve 21. The second portion more adjacent to thefirst air inlet 2201 of the first heat dissipating channel 7 a than thefirst portion. Because of such an arrangement, convention air will reachthe second portion first. That is, the second portion is better than thefirst portion in an effect of heat dissipation. Thus, at least part ofheat intolerance elements (e.g. electrolytic capacitors or otherelements which is sensitive to high temperature) should be disposed inthe second portion. Preferably, all electrolytic capacitors are disposedin the second portion. The power board 51 of the second portion isgreater than the first portion in area, so the power board 51 of thesecond portion has more space for accommodating electronic components tobe advantageous to more heat intolerance elements being disposed in thesecond portion. In this embodiment, heat intoleranceelements/thermo-sensitive elements may be separately mounted on twoopposite sides of the second portion. In other embodiments, hotterelectronic components may be disposed in the second portion (e.g.transformers, inductors, resistors, ICs or transistors) for better heatdissipation.

FIG. 15 is a schematic view of an embodiment of the power source 5,which can be applied to the power source 5 of the LED lamp shown in FIG.4. As shown in FIG. 15, in some embodiments, the power board 51 isdivided into a first mounting zone 511 and a second mounting zone 512 byan axis X. The axis X is between the first mounting zone 511 and thesecond mounting zone 512 as a border. Total weight of the electroniccomponents on the second mounting zone 512 is greater than total weightof the electronic components on the first mounting zone 51. The firstmounting zone 511 is provided with a counterweight 52 to balance the twozones 511, 512 of the power board 51 in weight. This can preventunbalanced weight of the two zones 511, 512 of the power board 51 andprevent the hung LED lamp from tilting because of unbalanced weight.

FIG. 16 is a main view of the counterweight 52 of FIG. 15. FIG. 17 is aside view of FIG. 16. As shown in FIGS. 16 and 17, in some embodiments,the counterweight 52 is a heat dissipating element with heat dissipatingfunction and is disposed on the power board 51. In some embodiments, theheat dissipating assembly has fins 521 for increasing heat dissipatingarea. The counterweight 52 is made of metal with highthermo-conductivity such as aluminum or copper. In this embodiment, thefins 521 are extendedly arranged along the axial direction of the LEDlamp. A channel is formed between two adjacent fins 521 as an airpassage. Such an arrangement can increase heat dissipating area of thecounterweight 52. In one embodiment, the counterweight 52 includes along side and a short side. The channels are parallel with the long sideand the long side is configured to be parallel with the axis of the LEDlamp or substantially parallel with the direction of airflow to make theair flow smoothly.

As shown in FIG. 15, the electronic components include heat-generatingelements which generate heat when working. At least one heat-generatingelement is adjacent to a heat dissipating assembly to dissipate part ofheat through the heat dissipating assembly. Preferably, transformers,inductors, resistors, diodes, transistors or ICs of the heat-generatingelements are adjacent to the heat dissipating assembly. More preferably,transformers, inductors, resistors, diodes, transistors or ICs of theheat-generating elements are in direct contact with the heat dissipatingassembly.

In one embodiment of the present invention, two opposite sides of thecircuit board all comprise the counterweight 52, such that the heatdissipating efficiency of the circuit board 51 and the weight balancebetween two sides of the circuit board 51 can be improvedsimultaneously.

As shown in FIG. 15, in some embodiments, the power board 51 is dividedinto a first mounting zone 511 and a second mounting zone 512 by an axisX. The axis X is between the first mounting zone 511 and the secondmounting zone 512 as a border. The second mounting zone 512 is greaterthan the first mounting zone 511 in number of electronic components tomake airflow of the first mounting zone 511 smooth and to reduceobstruction of the electronic components. In this embodiment, both thefirst mounting zone 511 and the second mounting zone 512 haveheat-generating elements to distribute heat sources.

As shown in FIGS. 4, 15 and 18, in some embodiments, the first heatdissipating channel 7 a includes an inner channel 7 a 1 and an outerchannel 7 a 2. The outer channel 7 a 2 is formed between the electroniccomponents on an edge of the power board 51 and an inner wall of theinner chamber of the lamp shell 2. The inner channel 7 a 1 is formed ingaps between the electronic components. This arrangement can enhance aneffect of heat dissipation of the power source 5. In detail, the powerboard 51 in FIG. 15 is divided into two portions (a left portion and aright portion, not necessarily symmetrical), namely, a first portion anda second portion. Both the first portion and the second portion haveelectronic components. The outer channel 7 a 2 is formed between theelectronic components on both the first portion and the second portionand the inner wall of the lamp shell 2. The inner channel 7 a 1 isformed between the electronic components separately on the first portionand the second portion. In this embodiment, a transformer 54 of theelectronic components includes a core 541 and coils 542. The core 541has a chamber in which the coils 542 are disposed. An opening is formedat a side of the chamber in a radial direction to expose the coils 542.The opening corresponds to the inner channel 7 a 1 or the outer channel7 a 2 to make heat from the coils 542 is rapidly ejected throughconvection in the inner channel 7 a 1 or the outer channel 7 a 2.Preferably, two openings are separately formed at two sides of thechamber in a radial direction. One of the two openings corresponds tothe inner channel 7 a 1 and the other one thereof corresponds to theouter channel 7 a 2 to further enhance heat dissipation of thetransformer.

As shown in FIGS. 1, 2, 3 and 4, the lamp shell 2 includes the lamp head23, the lamp neck 22 and the sleeve 21. The lamp head 23 connects to thelamp neck 22 which connects to the sleeve 21. The sleeve 21 is locatedin the heat sink 1 (in the axial direction of the LED lamp, all or mostof the sleeve 21, for example, at least 80% of height of the sleeve 21,does not exceed the heat sink 1). The lamp neck 22 projects from theheat sink 1. Both the sleeve 21 and the lamp neck 22 can providesufficient space to receive the power source 5 and perform heatdissipation, especially for the power source 5 of a high power LED lamp(in comparison with a low power LED lamp, a power source of a high powerLED lamp has more complicated composition and larger size). The powersource 5 is received in both the lamp neck 22 and lamp head 23. Totalheight of the lamp neck 22 and the lamp head 23 is greater than heightof the heat sink 1 so as to provide more space for receiving the powersource 5. The heat sink 1 is separate from both the lamp neck 22 and thelamp head 23 (not overlap in the axial direction, the sleeve 21 isreceived in the heat sink 1). Thus, the power source 5 in both the lampneck 22 and the lamp head 23 is affected by the heat sink 1 slightly(heat of the heat sink 1 would not be conducted to the lamp neck 22 andthe lamp head 23 along a radial direction). In addition, theconfiguration of height of the lamp neck 22 is advantageous to thechimney effect of the first heat dissipating channel 7 a to guaranteeconvection efficiency of the first heat dissipating channel 7 a. Inother embodiments, height of the lamp neck 22 is at least 80% of heightof the heat sink 1 to accomplish the above function. The sleeve 21 ismade of a thermo-isolated material to prevent mutual influence of heatfrom the fins and the power source.

As shown in FIG. 2, the second air inlet 1301 is located in a lowerportion of the heat sink 1 and radially corresponds to an inner side orthe inside of the heat sink 1, i.e. the second air inlet 1301 radiallycorresponds to the inner side or the inside of the fins 11. The innerside or the inside of the fins 11 corresponds to an outer wall (aradially inner side of the fins 11, which nears or abuts against thesleeve 21) of the sleeve 21 of the lamp shell 2. Thus, after convectionair flows into the second air inlet 1301, it flows upward along theouter wall of the sleeve 21 to perform convection and radiallydissipates heat in the inner side or the inside of the fins 11 and theouter wall of the sleeve 21 to implement an effect of thermal isolation.That is, this can prevent heat of the heat sink 1 is conducted from theouter wall of the sleeve 21 to the inside of the sleeve 21 not to affectthe power source 5. From the above, the second heat dissipating channel7 b can not only enhance heat dissipation of the fins 11, but alsoimplement an effect of thermal isolation. Make a positional comparisonbetween the second air inlet 1301 and the LED chips 311, the second airinlet 1301 is located radially inside all of the LED chips 311.

FIG. 19 is an enlarged view of portion B in FIG. 2. As shown in FIG. 19,the lamp head 23 includes a metal portion 231 and an insulative portion232. Wires of the power source 5 penetrates through the insulativeportion 232 to connect with an external power supply. The metal portion231 connects to the lamp neck 22. In detail, as shown in FIG. 20, aninner surface of the metal portion 231 is provided with a thread throughwhich the lamp neck 22 can be screwed on with the metal portion 231.While the metal portion 231 is dissipating heat generated from the powersource 5 in the lamp shell 2 (as described in the above embodiment, atleast part of the inner wall of the metal portion 231 forms a wall ofthe inner chamber of the lamp shell 2, so the thermal conductor directlyconnects with the metal portion 231 and the metal portion 231 can beused for heat dissipation), an outer surface of the metal portion 231 isformed with a projecting structure 2311 as shown in FIG. 20 to addsurface area of the outer surface of the metal portion 231 and enlargeheat dissipating area of the metal portion 231 to increase efficiency ofheat dissipation. As for the power source 5, at least part of the powersource 5 is located in the lamp head 23, and at least part of heatgenerated from the power source 5 can be dissipated through the lamphead 23. The inner wall of the metal portion 231 may also be formed witha projecting structure to add surface area of the inner chamber of thelamp shell 2. In this embodiment, the projecting structure can beimplemented by forming a thread on the inner surface of the metalportion 231.

As shown in FIGS. 21 to 29, the present disclosure provides a powersupply module for LED lamp. The power supply module includes input ends(ACN, ACL) for receiving AC driving signal; a first rectifying circuit100 for converting the AC driving signal into rectified signal; afiltering 200 for converting the rectified signal into filtered signal;a power converter 400 for converting the filtered signals into powersignal which is capable of lighting up an LED light source 500; and abias generating circuit 600 electrically connected to the input ends(ACN, ACL) and the power converter 400 for performing buck-conversion tothe AC driving signal to generate a working voltage of the powerconverter 400.

In the power supply module of certain embodiments, the bias generatingcircuit 600 performs buck-conversion to the AC driving signal andconverts the AC driving signal into a working voltage of the powerconverter 400. The working voltage is provided to the power converter400 so that the power converter 400 can drive the LED light source 500to emit light. It can be seen that, by utilizing the bias generatingcircuit 600 to perform active power conversion to externally input ACdriving signal, to the working voltage can be generated rapidly generatethe so as to effectively improve starting speed of an LED lamp.

The power supply module can be applied to high power LED lamps. Outputpower of the power converter 400 may be above 30 W. As shown in FIG. 22,the input ends (ACN, ACL) may be two ends of the power supply module: afirst end ACL and a second end ACN. The AC driving signal is inputthrough the two ends. The AC driving signal may be AC signal of 220V orany other voltage values. Of course, the input ends (ACN, ACL) may havemore than two ends, for example, four ends. It is not limited as long asAC power can be input.

In this embodiment, the first rectifying circuit 100 may be a bridgerectifier. As shown in FIG. 23, which is a circuit diagram of arectifying circuit and a filtering circuit of an embodiment of theinvention, the first rectifying circuit 100 includes diodes D7, D8, D9and D10. The first rectifying circuit 100 performs full waverectification to the AC driving signal to generate DC driving signal (DCpower).

In detail, as shown in FIG. 23, anodes of diodes D7, D9 are electricallyconnected to a first end of the filtering circuit 200, cathodes ofdiodes D7, D9 are electrically connected to anodes of diodes D8, D10,and cathodes of diodes D8, D10 are electrically connected to a secondend of the filtering circuit 200. Contacts of diodes D7 and D8 areelectrically connected to the first end ACL. A cathode of diode D8 iselectrically connected to a cathode of diode D10. Contacts of diodes D9and D10 are electrically connected to the second end ACN.

In this embodiment, the filtering circuit 200 includes capacitors C1, C2and an inductor L1. First ends of both capacitor C1 and inductor L1serve as the second end of the filtering circuit 200 to electricallyconnect with cathodes of diodes D8 and D10. The second end of inductorL1 is electrically connected to the first end of capacitor C1. Thesecond ends of capacitors C1 and C2 serve as the first end of thefiltering circuit 200 to electrically connect with anodes of diodes D7and D9. The filtering circuit 200 receives the DC power (the rectifiedsignal) rectified by the first rectifying circuit 100 and filters highfrequency components of the DC power. The DC power filtered by thefiltering circuit 200 is a relatively flat DC waveform. The filteredsignal is sent to a post-stage circuit through connecting ends 301 and302.

An electro-magnetic interference (EMI) reduction circuit 900 may bedisposed between the input ends (ACN, ACL) and the rectifying circuit100. The EMI reduction circuit 900 can reduce influence to the drivingsignal from an interference magnetic field. In the EMI reduction circuit900, a power line (including a main line and/or a branch of the mainline) electrically connected to two ends of the input ends ACN, ACL iselectrically connected with an excitation coil LF2 connecting a resistorbranch (e.g. a branch at which resistor R1 is located) and capacitorbranches (e.g. branches at which capacitors CX1, CX2, CX3 are located),and separately electrically connecting inductor Li1, Li2 at twobranches.

In this embodiment, the power converter 400 converts the filtered signalinto an electrical signal which is capable of lighting up the LED lightsource 500. The power converter 400 may change voltage level of thefiltered signal to generate DC driving signal with target voltage value.The power converter 400 has an output end for outputting DC drivingsignal with target voltage values.

FIG. 25 is a circuit diagram of a power converter of an embodiment ofthe invention. As shown in FIGS. 21 and 25, the power converter 400receives signal from a pre-stage circuit through the connecting end 401,402, and the power signal are provided to a post-stage through theconnecting ends 5001, 5002. The power converter 400 may adopt a PWM(Pulse Width Modulation) circuit, which controls pulse width to outputtarget signal. In detail, the power converter 400 includes a controllerU2, a power switch Q2, a transformer T2 and a diode D10. Controller U2,power switch Q2, diode D10 and an energy storage coil (a coil of thetransformer T2, which is electrically connected between the power switchQ2 and the connecting end 5002) cooperate to output power signal (DCdriving signal) with required voltage and/or current. The controller U2is activated by a working voltage VCC provided by the bias generatingcircuit 600 to output PWM control signal to control switching of thepower switch Q2, so that the energy storage coil repeatedly charge anddischarge in response to the switching state of power switch and thecontinuity of the current can be maintained through diode D4 (which isoperated as a flyback diode), and thus generate the required powersignal between the connecting ends 5001, 5002.

Power switch Q2 may be a MOSFET. A first end (power end) of controllerU2 electrically connects to an output end of the bias generating circuit600. A second end of controller U2 electrically connects to an end oftransformer T2. An end of the energy storage coil of transformer T2electrically connects to a negative end (i.e. connecting end 5002) ofthe DC output ends and the other end thereof electrically connects to ananode of diode D4. An anode of diode D4 electrically connects to apositive end (i.e. the connecting end 5001) of the DC output ends. Anend of the induction coil of transformer T2 electrically connects to asecond end of controller U2 and the other end of the induction coil isgrounded. A third end of controller U2 electrically connects to acontrol end of power switch Q2 through resistor R9. A first end of powerswitch Q2 electrically connects to a connecting point between diode D4and transformer T2, and a second end of power switch Q2 connects to afourth end of controller U2. Power converter 400 may be further providedwith a sampling circuit to sample its working status and serve as areference of output signal of the controller U2.

For example, the sampling circuit includes resistors R8, R10, capacitorC6 and an induction coil of the transformer T2. The controller U2 maysample voltage of the main line from resistor R8 and capacitor C6through its first end, sample output current from the induction coilthrough its second end and sample current flowing through the powerswitch Q2 from an end of resistor R10 through its fourth end.Configuration of the sampling circuit is related to the control mannerof the controller U2, the invention is not limited to this embodiment.

In this embodiment, at least one end of the switch controller U3electrically connects to a branch at which inductor L2 is located. Afiltering element and/or current stabilizer may be added between theswitch controller and the inductor. The present invention is not limitedthereto.

To reduce both influence resulting from harmonic to circuit propertiesand conversion loss, a power factor correction (PFC) circuit 300 may bedisposed between the power converter 400 and filtering circuit 200. ThePFC circuit 300 can increase power factors of the filtered signal byadjusting signal properties (e.g. phase, level or frequency) of thefiltered signal. PFC circuit 300 electrically connects to an output endof bias generating circuit 600. In detail, PFC circuit 300 may be anactive PFC circuit.

FIG. 24 is a circuit diagram of a PFC circuit of an embodiment of theinvention. As shown in FIG. 24, PFC circuit 300 receives signal from thefiltering circuit 300 through the connecting ends 301, 302 and sendscorrected signal to the post-stage power converter 400 throughconnecting ends 401, 402. PFC circuit 300 includes a controller U1, apower switch Q1 electrically connected to controller U1, a transformerT1 and a diode D3. Power switch Q1 may be a MOSFET. A first end (powerend) of the controller U1 electrically connects to an output end 607 ofbias generating circuit 600. A second end of controller U1 electricallyconnects to an end of transformer T1. A coil of transformer T1electrically connects to a main branch in series. The other end of thecoil electrically connected to a second end of controller U1 isgrounded. A positive end (also called connecting end 5001) of the DCoutput ends electrically connects to the main branch. Diode D3 iselectrically connected in the branch in series. An anode of diode D3electrically connects to both an end of transformer T1 and the filteringcircuit 200, and a cathode thereof electrically connects to connectingend 401 for electrically connecting to both power converter 400 andconnecting end 5001. A third end of controller U1 electrically connectsto power switch Q1. An end of power switch Q1 electrically connects to afifth electrically connecting point between diode D3 and transformer T1.Controller U1 may further electrically connects to a sampling circuit (aconnecting point between resistor R2 and capacitor C3 electricallyconnects to the controller U1, and capacitor C3 electrically connects toresistor R3 in parallel) and other circuits as shown in FIG. 24.

FIG. 26 is a circuit diagram of a bias generating circuit of the firstembodiment of the invention. As shown in FIGS. 22 and 26, biasgenerating circuit 600 a may include an electricity obtainer 610, aswitch controller U3 and an energy storage flyback unit 630. Electricityobtainer 610 electrically connects to both the input ends (ACN, ACL) andswitch controller U3. Switch controller U3 electrically connects toenergy storage unit 630 having an output end 607 for outputting aworking voltage (VCC). Output end 607 electrically connects to powerconverter 400 to provide the working voltage (VCC) to the powerconverter 400.

Switch controller U3 controls switching frequency of the energy storageunit 630 according to an electricity obtaining signal from theelectricity obtainer 610 to generate the working voltage of the powerconverter 400 and uses the output end 607 to output the working voltageto the power converter 400. The switch controller U3 is activated byresponding to the electricity obtaining signal from the electricityobtainer 610 and repeatedly switches on and off to periodically chargeand discharge by controlling conducting time of the energy storage unit630. And diode D5 is used to keep flyback. Thus, the working voltage ofthe power converter 400 is formed and is output to the power converter400 through the output end 607.

In an embodiment, the electricity obtainer 610 can convert AC drivingsignal into DC electricity obtaining signal which are equal to the ACdriving signal. As shown in FIGS. 22 and 26, electricity obtainer 610can be implemented by a second rectifying circuit (hereinafter “secondrectifying circuit 610”). Second rectifying circuit 610 includes a firstdiode D1 and a second diode D2, which are electrically connected inseries with opposite polarity (i.e. cathodes of diodes D1 and D2 areelectrically connected together). Second rectifying circuit 610 has anelectricity obtaining end 601 between diodes D1 and D2. The electricityobtaining end 601 electrically connects to the switch controller U3. Bythe opposite polarity, the two diodes D1 and D2 rectify the AC drivingsignal to output DC driving signal at the electricity obtaining end 601.

In detail, the electricity obtaining end 601 further electricallyconnects to an end of first capacitor C9, and the other end thereofelectrically connects to the ground end GND. Switch controller U3electrically connects to an end of inductor L2, and the other endthereof connects to the output end 607. Inductor L2 can perform bothenergy storage and release and maintain the current continuity whenswitch controller U3 is switching.

In this embodiment, energy storage flyback unit 630 may include aninductor L2, a third diode D5 and a second capacitor C11. A cathode ofthe third diode D5 connects to a connecting end 603 disposed between theswitch controller U3 and inductor L2. An anode of third diode D5connects to ground end GND. An end of second capacitor C11 electricallyconnects to a second connecting end 604 disposed between inductor L2 andthe output end 607. The other end of second capacitor C11 electricallyconnects to the ground end GND. an end of a load resistor electricallyconnects to a third connecting end (not shown in FIG. 22) disposedbetween the second connecting end 604 and the output end 607. The otherend of the load resistor electrically connects to ground end GND.

Further, switch controller U3 may be a MOSFET switch or an IC shipintegrated with a MOSFET switch. Of course, in some embodiments, switchcontroller U3 may be a BJT switch. Switch controller U3 has multipleconnecting ends (also called connecting port). An electricity obtainingbranch is formed between the electricity obtaining end 601 and theground end GND. The first capacitor C9 is connected in the electricityobtaining branch in series. At least one connecting end of switchcontroller U3 electrically connects to the electricity obtaining end 601through the electricity obtaining branch. A branch at which both theelectricity obtaining branch and capacitor C9 are located electricallyconnects to the electricity obtaining end 601 through the fourthconnecting end 602. The ground end GND electrically connected to agrounding line 640. All of the third diode D5, the second capacitor C11and the load resistor electrically connect to the grounding line 640.

The bias generating circuit 600 may be further provided with a samplingcircuit to sample its working status and to be a reference of outputsignal of the switch controller. In addition, in the practicalapplication, switch controller U3 may be a chip or IC integrated with atleast a control circuit and a power switch, but the present invention isnot limited thereto.

For example, the sampling circuit may include a first sampling circuit650 and a second sampling circuit 620. First sampling circuit 650electrically connects to both the electricity obtaining end 601 (forminga connecting point 605 in FIG. 26) and switch controller U3. The secondsampling circuit 620 electrically connects to both the output end 607and switch controller U3. Switch controller U3 outputs a stable workingvoltage according to sampling signal from both the first samplingcircuit 650 and second sampling circuit 620. Configuration of thesampling circuit is related to the control manner of switch controllerU3, the invention is not limited to this. FIG. 26 is a circuit diagramof the bias generating circuit of the first embodiment of the invention.

In other embodiments, the bias generating circuit may also be used forproviding a working voltage to a temperature sensing circuit 700. FIG.27 is a circuit diagram of the bias generating circuit of the secondembodiment of the invention. FIG. 28 is a circuit diagram of atemperature sensing circuit of an embodiment of the invention. As shownin FIGS. 27 and 28, the temperature sensing circuit 700 electricallyconnects to power converter 400 for sending temperature detecting signalto power converter 400. The temperature sensing circuit 700 has atemperature sensor electrically connecting to bias generating circuit600 b to make bias generating circuit 600 b provide a working voltage totemperature sensing circuit 600 b.

In this embodiment, in comparison with the embodiment shown in FIG. 26,the bias generating circuit 600 b of this embodiment further includes atransistor Q3, a diode D6, a resistor R12 and a capacitor C10.Transistor Q3 may be a BJT as an example (hereinafter refer as BJT Q3).The temperature detector 700 electrically connects to BJT Q3 of the biasgenerating circuit 600 b. The collector of BJT Q3 electrically connectsto output end 607. The base of BJT Q3 electrically connects to thegrounding line with the ground end GND.

The temperature sensing circuit 700 is activated by responding to theworking voltage provided by the bias generating circuit 600 b throughthe connecting ends 701 and 702 and feeds temperature data (Vtemp) backto the controller U2 of the power converter 400. When a temperatureexceeds a threshold value (indicating a situation of overheating), thecontroller U2 of the power converter 400 would reduce output power todecrease temperature and guarantee the safety during operation.

Moreover, as shown in FIG. 29, the temperature sensing circuit 700further electrically connects to a temperature compensator 800. FIG. 29is circuit diagram of a temperature compensator of an embodiment of theinvention. Temperature sensing circuit 700 electrically connects betweentemperature compensator 800 and bias generating circuit 600 b.Temperature compensator 800 electrically connects to power converter400.

Temperature compensator 800 makes a reference temperature of a free endof the temperature sensing circuit more reasonable. The temperaturecompensator 800 in this embodiment can be implemented by a comparator CP(but not limited to this). An input end of comparator CP receives avoltage, indicating a temperature information, through connecting end801 and compares the voltage indicating the temperature information witha reference voltage Vref of another input end of comparator CP, suchthat whether the temperature sensed by the temperature sensing circuit700 exceeds a threshold value can be determined and a temperaturesensing result signal Vtemp indicating whether the sensed temperatureexceeds a threshold value is generated at an output end of thecomparator CP. The output end of the temperature compensator 800electrically connects to the controller U2 of the power converter 400 tomake the temperature sensing result signal Vtemp fed back to controllerU2 of power converter 400, so that controller U2 can adjust the outputpower depending on the system environment temperature.

In another embodiment, the temperature compensator 800 may have aregulator diode and a thermistor. After the thermistor, the temperaturecompensator 800 electrically connects to an amplifier through anadjustable potentiometer. A negative end of the amplifier electricallyconnects to an output end of the temperature compensator 800.

In detail, a circuit diagram of the temperature compensator 800 may beas shown in FIG. 29. It should be noted that, the temperaturecompensator 800 can be implemented by various manners. The invention isnot limited to the circuit shown in FIG. 29.

The invention further provides a high power LED lamp including an LEDlight source 500 and a power supply module as abovementioned connectingwith the LED light source 500. In some embodiments, the high power LEDlamp means all types of LED lamps whose output power exceeds 30 w, LEDlamps which are equivalent to xenon lamps with output power of at least30 W or LED lamps using high power lamp beads (e.g. lamp beads withrated current above 20 mA).

All digital values mentioned in the description include all valuesbetween an upper limit and a lower limit with upper or lower values ofincrement or decrement by one unit, an interval of at least two unitsbetween any lower value and its higher value is available. For example,if a value of a recited quantity of an element or a process variable(e.g. temperature, pressure, time, etc.) is between 1 and 90,preferably, between 20 and 80, more preferably, between 30 and 70, itmeans inclusion of between 15 and 85, between 22 and 68, between 43 and51, between 30 and 32, etc. For a value less than 1, one unit may beproperly deemed as 0.0001, 0.001, 0.01 and 0.1. This merely intents toclearly express exemplary values. That is, all values and theircombinations between the lowest value and the highest value are includedin ranges described in the specification.

The above depiction has been described with reference to theaccompanying drawings, in which exemplary embodiments of the disclosureare shown. This disclosure may, however, be embodied in many differentforms and should not be construed as limited to the embodiments setforth herein. Rather, these embodiments are provided so that thisdisclosure will be thorough and complete, and will fully convey thescope of the disclosure to those skilled in the art.

What is claimed is:
 1. An LED (light emitting diode) lamp comprising: alamp shell including a lamp head, a lamp neck and a sleeve, the lamphead connects to the lamp neck which connects to the sleeve; a passiveheat dissipating element having a heat sink connected to the lamp shell,wherein the heat sink comprises fins and a base, the sleeve of the lampshell is located in the heat sink, the lamp neck projects from the heatsink, height of the lamp neck is at least 80% of height of the heatsink; a power source having a first portion and a second portion,wherein the first portion of the power source is disposed in both thelamp neck and the lamp head of the lamp shell, and the second portion ofthe power source is disposed in the heat sink of the passive heatdissipating element; a light emitting surface connected to the heat sinkof the passive heat dissipating element and comprising LED chipselectrically connected to the power source, wherein the light emittingsurface and the heat sink are connected to form a heat transferring pathfrom the LED chips to the passive heat dissipating element; a first heatdissipating channel formed in a first chamber of the lamp shell fordissipating heat generated from the power source while the LED lamp isworking, and the first chamber is located between the bottom of the LEDlamp and the upper portion of the lamp neck; a second heat dissipatingchannel formed in the heat sink and between the fins and the base fordissipating the heat generated from the LED chips and transferred to theheat sink; and a lamp cover connected with the heat sink and having alight output surface and an end surface, wherein the end surface isformed with a vent to allow air flowing from outside of the LED lampinto both the first heat dissipating channel and the second heatdissipating channel through the vent; wherein the first heat dissipatingchannel comprises a first end on the light emitting surface to allow airflowing from outside of the LED lamp into the first chamber, and asecond end on the upper portion of the lamp neck of the lamp shell toallow air flowing from inside of the first chamber out to the LED lamp;wherein the second heat dissipating channel comprises a third end on thelight emitting surface to allow air flowing from outside of the LED lampinto the second heat dissipating channel, and flowing out from spacesbetween every adjacent two of the fins; wherein the power sourceincludes a power board and a plurality of electronic components mountedthereon; wherein the first heat dissipating channel includes an innerchannel and an outer channel, the outer channel is formed between theelectronic components on an edge of the power board and an inner wall ofthe first chamber of the lamp shell, the inner channel is formed in gapsbetween the electronic components, a transformer of the electroniccomponents includes a core and coils, the core has a second chamber inwhich the coils are disposed, an opening is formed at a side of thesecond chamber in a radial direction to expose the coils, and theopening corresponds to the inner channel or the outer channel.
 2. TheLED lamp of claim 1, wherein two openings are separately formed at twosides of the second chamber in a radial direction, one of the twoopenings corresponds to the inner channel and the other one thereofcorresponds to the outer channel.
 3. The LED lamp of claim 2, whereinthe electronic components include heat-generating elements, at least oneof the heat-generating element is in thermal contact with the lamp headthrough a thermal conductor, the at least one of the heat-generatingelement is disposed in the lamp head.
 4. The LED lamp of claim 3,wherein the thermal conductor is disposed in the lamp head throughfilling to implement connection between the lamp head and theheat-generating element, the thermal conductor only cloaks an endportion of the power source and is higher than the second end on theupper portion of the lamp neck of the lamp shell in position.
 5. The LEDlamp of claim 4, wherein the lamp head includes a metal portion, atleast part of an inner side of the metal portion constitutes a wall ofthe inner chamber of the lamp shell to make the thermal conductordirectly connect with the metal portion.
 6. The LED lamp of claim 5,wherein at least one of the electronic components of the power source,which is most adjacent to the first end of the first heat dissipatingchannel is an electrolytic capacitor.
 7. The LED lamp of claim 6, partof the electrolytic capacitor exceeds the power board in the axialdirection of the LED lamp.
 8. The LED lamp of claim 7, wherein the powerboard is divided into a first mounting zone and a second mounting zone,total weight of the electronic components on the second mounting zone isgreater than total weight of the electronic components on the firstmounting zone, and a counterweight is provided on the first mountingzone to balance the two zones of the power board in weight.
 9. The LEDlamp of claim 8, wherein the counterweight is a heat dissipating elementwith heat dissipating function and is disposed on the power board. 10.The LED lamp of claim 9, wherein the heat dissipating assembly has finsfor increasing heat dissipating area, the fins are extendedly arrangedalong the axial direction of the LED lamp, a channel is formed betweentwo adjacent fins as an air passage.
 11. The LED lamp of claim 10,wherein an aperture is located in a central region of the light board,and the aperture forms an air intake of both the first heat dissipatingchannel and the second heat dissipating channel.
 12. The LED lamp ofclaim 11, wherein the sleeve corresponds to the aperture.
 13. The LEDlamp of claim 12, wherein the heat sink comprises first fins and secondfins, bottoms of both the first fins and the second fins in an axis ofthe LED lamp connect to the base, the first fins interlace with thesecond fins at regular intervals, and one of the second fins includes athird portion and two fourth portions, the two fourth portions aresymmetrical about the third portion.
 14. The LED lamp of claim 13,wherein each of the first fins is divided into two portions in a radialdirection of the LED lamp, the two portions are divided with a gapportion, the third portion is connected to the fourth portion through atransition portion, the transition portion has a buffer section and aguide section, a direction of any tangent of the guide section isseparate from the gap portion.
 15. The LED lamp of claim 14, wherein thepower board has a first portion in the lamp neck and a second portion inthe sleeve, the second portion more adjacent to the first end of thefirst heat dissipating channel than the first portion.
 16. The LED lampof claim 15, wherein at least part of the electrolytic capacitors aredisposed in the second portion.
 17. The LED lamp of claim 15, whereinall of the electrolytic capacitors are disposed in the second portion.